Showing posts with label THERMAL COMPOUND. Show all posts
ARCTIC SILVER 5 THERMAL COMPOUND 12 GRAMS
Arctic Silver® 5
High-Density Polysynthetic Silver Thermal Compound
High-Density Polysynthetic Silver Thermal Compound
With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.
- 99.9% pure micronized silver
- Non-electrically conductive
- Will not separate, run, migrate or bleed
- Average Particle Size: <0.49 micron <0.000020 inch
ARCTIC SILVER CERAMIQUE 2 THERMAL COMPOUND 2.7 GRAMS
Céramique™ 2
Tri-Linear Ceramic Thermal Compound
Tri-Linear Ceramic Thermal Compound
The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
- Oil mixture
- Improved thermal filler properties and increased particle deagglomeration
- Will not separate, run, migrate or bleed
- Average Particle Size: <0.36 micron <0.000014 inch
ARCTIC SILVER 5 THERMAL COMPOUND 3.5 GRAMS
Arctic Silver® 5
High-Density Polysynthetic Silver Thermal Compound
High-Density Polysynthetic Silver Thermal Compound
With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.
- 99.9% pure micronized silver
- Non-electrically conductive
- Will not separate, run, migrate or bleed
- Average Particle Size: <0.49 micron <0.000020 inch
